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기계가공/시험장비 > 반도체장비 > 본딩기

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- 나노바이오센서와 PCB 기판의 전극 형성후 패키징을 위해 와이어를 연결해주는 장비로 와이어와 전자 소자간의 정렬후 자동적으로 연결해주는 장비임 - 다양한 형태의 바이오센서용 패키징 공정 평가

1. System Configuration 1) Ultrasonic generator with PLL 2) Ultrasonic generator frequency resolution is < 1Hz 3) Round and Ribbon type of wire Wedge Bondhead 89° feed angle - Round Wire size Al, Au: 17.5㎛m - 50㎛ - Round Wire size Cu: 12.5㎛ - 50㎛ 4) Round type of wire Wedge Bondhead 45° feed angle - Round Wire size Al, Au: 17.5㎛ - 50㎛ - Ribbon Wire size Al, Au: 6㎛ x 35㎛ - 25㎛ x 250㎛ 5) Round type of wire Ball Bondhead - Round Wire size Au: 15.5㎛ - 50㎛ 6) Integrated workholder 7) Wire spool size 1x2“ 8) Correction of rotary orientation ±5 degrees for two-point method 9) Correction of rotary orientation ±20 degrees for edge detection method 10) Image processing system Accuracy <3㎛ 11) Image Recognition time <10ms 2. Utility and operation environment requirement 1) Clean compressed air pressure : 6~10 bar 2) Temperature : 20 ~ 30 ℃, stability ±1℃ 4) Humidity : 80 % non-condensing required 5) Cleanness : class 10,000 or under 6) Electrical Power requirement : 2